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RS Series Vacuum reflow oven Product introduction:
Features
Application:
IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing
Feature of the vacuum reflow oven:
Vacuum furnace Technical parameter:
Parameter datasheet
Model | RS330 |
Soldering area | 330*330mm |
Soldering height | 100mm(Special requirement can be customized) |
Temperature scope | Peak value is 600ºC |
Peak Vacuum | ≤10Pa, mechanical Pump,≤10-6Pa molecular pump |
Heating rate | ≤120ºC/Min |
Cooling rate | ≤80-120ºC/Min |
Data interface | Serial 485 port / USB port |
Control mode | Software control system (TORCH independent patented software) |
Soldering process | Temperature control + vacuum pressure control |
Cooling mode | Air/water cooling (including heat exchanger and chiller) |
Rated power | 15KW |
Power supply | 3 Phases 5 line 220V 36a |
Overall dimension | 900*900*1600mm |
Weight | 270Kg |
Vacuum furnace Standard spare part :
Main body | 1 set |
Touch screen control computer | 1 set |
Temperature control | 1 set |
Pressure control | 1 set |
Closed cycle water cool system | 1 set |
4 real temperature test mode | 1 set |
Vacuum pressure transfer | 1 set |
Inert gas or nitrogen control | 1 set |
Water box | 1 set |
Cool water machine | 1 set |