• China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
  • China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
  • China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
  • China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
  • China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
  • China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

After-sales Service: 1 Year
Condition: New
Certification: ISO, CE
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Diamond Member Since 2010

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Basic Info.

Model NO.
RS220
Soldering Area
220mm*220mm
Furnace Height
100mm
Reducing Gas
Formic Acid
Temperature Range
up to 450c
Max Heating Rate
120c/Minute
Max Cooling Rate
90/Minute
Voltage
220V
Cooling Way
Air-Cooled / Water-Cooled (Shell, Heating Plate)
Inert Gases
Nitrogen/Hydrogen/Mixing
Transport Package
Wooden Case
Specification
94*84*162cm
Trademark
Torch
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Set/Year

Product Description

China TORCH Small Solder Reflow Oven for micro electronic packaging soldering RS220

China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

Function Introduction:
1. TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven (eutectic furnace). It especially designed for the fields in small batch production, R&D and functional materials test, etc.

China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

2. Industry application: RS series vacuum reflow soldering machine is the ideal choice for R&D, process research and development, low to high capacity production, and is the best choice for high-end R&D and production in military enterprises, research institutes, universities, aerospace and other fields.
3. Application: Mainly used for defect-free soldering of chips and substrates, tube shell and cover plate,and perfect solderless soldering, such as IGBT package, solder paste process, laser diode package process, optical communication device soldering, mixing Integrated circuit package, tube shell and cover plate package, MEMS and vacuum package.
4. Vacuum reflow has become an essential equipment for high-end manufacturing of military and industrial enterprises, aviation and aerospace in developed countries such as Europe and the United States, and has been widely used in chip packaging and electronic soldering.
China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

Features
1. It can realize welding under vacuum, nitrogen and reducing atmosphere. The 2-way process atmosphere system nitrogen and formic acid, nitrogen and formic acid are controlled by MFC mass flow meter, which precisely controls the input of process gas to ensure the consistency of each welding process.
2. Temperature control system independently developed by ourself TORCH, temperature control accuracy
±1 °C; 2 flexible (patented technology) temperature sensor in the device cavity, real-time testing the
temperature of heating plate surface and fixture surface or internal, surface of the device, provides temperature feedback for components soldering, and the number of temperature sensors can be increased according to
customer needs.
3. Use graphite material as heating platform to ensure temperature uniformity within the welding area ≤±2%.
4. Equipped with a mechanical vacuum pump, the vacuum can be up to 10Pa.
5. The upper cover of the cavity is equipped with an observation window, which can observe
the internal device changes in the cavity in real time.
6. Through the patented water cooling technology, to achieve rapid cooling and cooling in the
atmosphere, vacuum environment, the industry's fastest cooling effect.
7. The self-developed temperature control software, up to the industry's 40-stage
programmable temperature control system, can set the most perfect process curve.
8. Closed cavity structure ensures long-term reliability. When the upper cover is closed during use, the device will not be displaced, avoid device vibration affecting the quality of the weld.
9. The unique water-cooling technology can ensure that the cavity is not overheated during welding, and at the same time. At the same time, the cooling of the heating plate is achieved during cooling, thereby improving the cooling efficiency.
10. TORCH technology patented technology temperature control system, can ensure the consistency of the welding process, the temperature curve can be realistically repeated in the software system, through the coincidence of the process curve can determine the process consistency of the same process of the same product.
11. Set the process curve by yourself and monitor the set process curve in real time. The process curve is set according to the process requirements (up to 6 sets of PID settings), the process steps are not limited; can be stored, modified, recalled, etc., in the process curve software. the process curve during welding is displayed in real time and automatically saved, which is convenient for the process traceability; the software has its own process curve analysis function to analyze the heating, constant temperature and cooling; The unique welding curve repeating display technology of the same process can prove the consistency of each sintering process by the coincidence of the process curve, ensuring that the device process of each soldering is consistent.
12. The software has anti-error interlocking, over-temperature, over-pressure, time-out alarm and other protection functions. When the hardware of the device fails or the software is set incorrectly, the software automatically prompts and alarms to determine whether the process continues.

China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
Equipment Parameter
Model RS220
Soldering Size 220mm*220mm
Furnace height 100mm
Temperature Range Up to 450ºC
Connector Serial 485 network / USB
Control Mode Software control (temperature, pressure, etc.)
Temperature curve can store several curves Temperature of 40 segments
Voltage 220V
Rated Power 9KW
Actual Power 6KW(without vacuum pump)
Dimension 600*600*1300mm
Wight 250KG
The maximum heating rate 120ºC/min
The maximum cooling rate Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min
Cooling Way Air-cooled / water-cooled (shell, heating plate)

Configuration List:
  1. 1 set vacuum reflow soldering furnace main machine.
  2. 1 set temperature control system (Torch technology).
  3. 2 sets Temperature measuring system (comrade technology).
  4.  vacuum system 1). 1 set vacuum pump (mechanical oil pump), 2) 1 piece vacuum valve, 3) 1 piece vacuum gauge
  5. 1 set graphite heating platform (hard graphite).
  6. 1 set water cooling system (including water cooling machine).
  7. 1 set nitrogen atmosphere system.
  8. 1 set formic acid atmosphere system.
  9. 1 set vacuum reflow welding control software system (Torch technology software control system).
  10. 1 set industrial computer (advantech industrial computer).
  11. 1 set MFC mass flowmeter.
  12. 3 heating pipes and 2 thermocouples.
Optional:
  1. vacuum system: Vacuum pump (mechanical dry pump).
  2. Nitrogen hydrogen mixture atmosphere..
  3. CCD video system
China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220
China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220


China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

China Torch Small Solder Reflow Oven for Micro Electronic Packaging Soldering RS220

 

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