Inline Vacuum Plasma Cleaning Machine

• After-sales Service: All Life
• Warranty: 1year
• Transport Package: Wooden Case
• Model NO.: VPC3i
• Specification: 550*1260*1480mm
• Trademark: TORCH
• Origin: Beijing
• Package Size: 55.00cm * 126.00cm * 148.00cm
• Package Gross Weight: 500.000kg

Product Description

Inline vacuum plasma cleaning machine
Modle No.: VPC3i
Manufacturer : Beijing Torch SMT Incorporated Company


I. Equipment name, type number, origin and delivery date
1.1 Equipment name: Inline vacuum plasma cleaning machine
1.2 Model No.: VPC3i
1.3 Origin (country, manufacturer): Beijing Torch SMT Incorporated Company
1.4 Delivery date: 4-8 weeks after the contract comes into effect
1.5 Mainly used for plasma surface treatment process in semiconductor enclosure fields such as silicon wafer, glass substrate, ceramic substrate, IC carrier plate, copper lead frame, large-size single-sided substrate power board, IGBT module, MEMS sensor with fixture, microwave device, filter, RF device, etc.
II Main technical performance parameters:
2.1 volume of vacuum chamber: 3L
2.2 vacuum degree:
The maximum vacuum degree of VPC3i vacuum plasma cleaner is less than 10 Pa (mechanical dry pump 8L)
2.3 Effective cleaning area:
Single cleaning area: 350 * 100 * 85mm
Plasma frequency: 13.56hz 300W  RF (volume treatment, with water cooling)
2.4 Height of vacuum chamber:
Furnace height: 100mm (effective size)
2.5 Cleaning temperature:
Low temperature cleaning (below room temperature).
2.6 Cleaning frequency: 30-120s
2.7 Cleaning effect: the dyne value can reach 70. The water drop angle is 15 degrees, and it can be optimally controlled within 10 degrees(Workshop with air cleanliness at Class 100 dust-free can be cleaned within 4 hours)
2.8 Gas can be used:
Argon, nitrogen, oxygen, nitrogen hydrogen mixture, hydrogen and formic acid, etc.
2.9 VPC3i vacuum plasma cleaning machine is equipped with software control system:
The software control system is easy to operate, it enables control equipment connecting, and various cleaning process curves can be set, and curves can be set, modify, store and select for use according to different processes; The software has its own analysis function, which can analyze the process curve. The software control system will automatically record the cleaning process, temperature curve, time and alarm related data in real time to ensure the traceability of product cleaning process.
2.10 The equipment does not need to be calibrated thus no more calibration fees will occur
2.11 Operating power consumption: 2.2kW, excluding the power consumption of chiller
2.12 The function of over temperature alarm and recording. (standard configuration)
VPC3i vacuum plasma cleaning machine is functioned with workpiece surface over temperature protection,alarming, temperature safety protection and recording of the whole machine during cleaning process.
2.13 Nitrogen, argon and other flow management and analysis systems (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is functioned by real-time management and analysis of process gases such as nitrogen and argon consumed by the whole machine, and can record and analyze the gas consumption, daily consumption, weekly consumption and different time period consumption in real time.
2.14 Process gas pressure alarm function and analysis system (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is functioned by undervoltage alarm, recording and analysis of process gas source in the production process of the whole machine, which is very useful for product quality traceability.
2.15 Energy management and analysis system (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is functioned by real-time management and analysis of energy consumption, and can analyze the recording of real-time power consumption, daily power consumption, weekly power consumption, time period power consumption, etc.
2.16 Oxygen content management and analysis system (Software + hardware) (optional)
VPC3i vacuum plasma cleaning machine is functioned by real-time management and analysis of oxygen content in the vacuum chamber of the whole machine. It can analyze, record and analyze the PPM value of oxygen content in real time for product quality traceability and analysis.
2.17 MES data interface subsystem (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is also functioned by MES data interface of the whole machine, and MES system can be selected and configured to complete various data acquisition and analysis of intelligent equipment.
2.18 Overall dimensions:
550 * 1260 * 1480mm (excluding alarm light)
2.19 Internal structure: see the right figure

III Basic composition and configuration:

No	Description	configuration	qty
1	vacuum plasma cleaning machine	Main machine	1set
2	Plasma power system	Standard configuration	1set
3	Temperature measurement system	Standard configuration(4 groups of temperature measurement coupler)	1set
4	Vacuum system	Standard configuration	1set
5	Mechanical pump	Standard configuration	1set
6	Water cooling system	Standard configuration(Industrial cooling machine is excluded)	1set
7	Industrial cooling machine	Optional	1set
8	Formic acid system	Standard configuration(Formic acid, gas pipeline and connection)	1set
9	Nitrogen atmosphere protection system	Standard configuration(exclude nitrogen souce supplying)	1set
10	vacuum plasma cleaning machine software system	Standard configuration(control software)	1set
11	Industrial computer	Standard configuration	1set
12	Plasma	Standard configuration	1piece
13	Temperature measurement sensor (spare parts)	Standard configuration	2
14	Cooling pipeline (spare parts)	Standard configuration	2
15	Process gas volume management and analysis system	Optional	1set
16	Process gas pressure alarm and analysis system	Optional	1set
17	Power management and analysis system	Optional	1set
18	Oxygen content management and analysis system	Optional	1set
19	MES data interface system	Optional

IV VPC3i Technical parameter

Brand	Manufacturer	Beijing Torch SMT Incorporated Company	Remarks
Brief introduction	Origin	Beijing
Key components	Temperature sensor	US OMEGA
	Vacuum pump	KYKY/BSC
	Globe valve	Japan brand
	Corossion resistence valve	Japan brand
	Low voltage electric system
	Botton switch	Taiwan JICTEN
	Photoelectric	Omron
	Plasma power	TORCH
Key technical index	Temperature	Low temperature cleaning, temperature is maintained under room temperature
	Min. Vacuum degree	10pa
	Oxygen content	<1ppm
	Production efficiency	20-120S
Key process index	Quality traceability	1. Process gas pressure alarm record. 2. Oxygen content alarm record. 3. Temperature over temperature alarm record. 4. Alarm record of non-compliance of vacuum value
	Intelligence and informatization	1.Intelligent function. If one of the above 4 indicators fails to meet the standard or gives an alarm, an overall alarm and prompt to stop production will be displayed to ensure the production quality. 2. Energy management system, power consumption and nitrogen consumption are counted and displayed in real time in the energy management system. 3. All above information can be seamlessly connected to MES system through data interface to facilitate the decision-making and management of management team.
Facilities	Power	380VAC,20A
	Gas	Compressed air(CDA)0.5Mpa
	Nitrogen	0.5Mpa
	Vacuum	Equipped with vacuum dry pump

Note:
The control software for the vacuum plasma cleaning machine of Beijing Torch SMT Incorporated Company is independently developed by Beijing Torch SMT Incorporated Company and Beijing Torch SMT Incorporated Company pocesses the right of software registration without third-party certification.

The vacuum plasma cleaning machine from Beijing Torch SMT Incorporated Company has already obtained a number of national patents. Please do not risk copying!!