China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330

Product Details
After-sales Service: Engineer Go Oversea for Training
Condition: New
Certification: ISO, CE
Manufacturer/Factory & Trading Company

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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
  • China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
  • China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
  • China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
  • China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
  • China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
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Basic Info.

Model NO.
RS330
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Soldering Area
330mm*330mm
Chamber Height
100mm
Temperature Range
Room--450 C
Voltage
220V 50A
Max. Heating Rate
120c/Min
Max Cooling Rate
180c/Min
Cooling Way
Air-Cooled / Water-Cooled (Shell, Heating Plate)
Transport Package
Polywood Case and Foam
Specification
1200*1100*1400mm
Trademark
TORCH
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Set/Year

Product Description


China Cheap Vacuum oven for reflow soldering of Flip chip with tin ball RS330

Model: RS330
China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330

Applications:
Solder reflow with and without flux
Wafer bump and solder ball reflow
Flip chip
Encapsulation and sealing of housings
High Power LED module
Resistor paste firing
IGBT/DBC
Die attachment
Power Semiconductors
Sensors
MEMS Devices
Hybrid Assembly
Package Sealing

RS Series vacuum reflow oven (RS220/RS330)

Function Introduction:
1.TORCH promotes a new Vacuum Reflow Oven in RS series which is the fifth generation of its small Vacuum Reflow Oven.It especially designed for the fields in small batch production, R&D and functional materials test, etc.

RS series Vacuum Reflow Oven is heated in Vacuum environment to realize holeless soldering, can fulfill the test requirement from R&D department and production requirement of small batch.

RS series Vacuum Reflow Oven applicable to fluxless soldering without hollows at solder pot, available in various of gases, such as N2, N2/H2 95%/5%.

RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder slice.
RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.

2.RS series vacuum oven is mainly for high-demanding in welding, for example industrial high reliability product, even the nitrogen protective or the vapor phase soldering can not reach the demand.Like the material testing,chip package,power equipment, automobile product, train control, space and airborne systems etc soldering which need high reliability circuit.It need elimination and reduce the empty and oxidation welding material.How to reduce the voidage effectively, decrease the oxidation of the pad and the component pins?The vacuum oven is the only choice.If you want to achieve the high welding quality, we must need the vacuum oven machine.

3.Industry application:RS series vacuum oven is the best choice for R&D, process research and development, material test, device packaging, and it is the best option for high-end development and production in industrial enterprises, research institute, colleges, universities aerospace.

Features:

1.Soldering under full vacuum.The vacuum value can be up 10-3mba.(10-6-mba optional)
2.Welding environment is with low activity flux.
3.Professional software control can achieve the perfect operating experience.
4.40 industry segments programmable temperature control system can help to set the perfect technology curve.
5.Temperature settings can be adjusted, which can set the welding materials technology curve that is much closer to perfect the process.
6.Water-cooling technology achieves the industry's fastest cooling effect (standard)
7.Online temperature measurement function.Accurate measurement of the weld zone temperature uniformity.Provide professional support for the process of adjustment.
8.Nitrogen or other inert gas can meet the special requirements of the welding process.
9.Highest temperature is 450 ºC (higher optional), which can meet all the requirements of the soldering process.
10.Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (weldments over temperature protection, machine temperature safety protection, safe operation protection, welding cooling water protection, power protection)
Standard:

Packing List

One set computer
One set industry control computer
One set temperature control software
One set temperature controllor
One set pressure controllor
One set Inert gas or nitrogen gas control valve

Optional:
Corrosion resistant diaphragm pump, vacuum 10mba;
Rotary vane pump, used for vacuum of 10-3mba;
Eddy turn molecular pump system, used for vacuum of 10-6mba;
4.Hydrogen and hydrogen-type safety device
5.High Temperature Module (500 degree high temperature

 

Vacuum furnace Technical parameter:

China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330

Model

RS330

Soldering Size

330*330mm

Furnace height

100mm(other Hights is optional)

Temperature Range

Up to 450ºC

Connector

Serial 485 network / USB

Control Mode

Software control (temperature, pressure, etc.)

Temperature curve

can store several curves Temperature of 40 segments

Voltage

220V

Rated Power

9KW

Actual Power

6KW(without vacuum pump)

Dimension

600*600*1300mm

Wight

250KG

The maximum heating rate

120ºC/min

The maximum cooling rate

Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min

Cooling Way

Air-cooled / water-cooled (shell, heating plate)

 

Vacuum furnace Standard spare part :

Main body  1 set
Touch screen control computer 1 set
Temperature control  1 set
Pressure control      1 set
Closed cycle water cool system 1 set
4 real temperature test mode  1 set
Vacuum pressure transfer  1 set
Inert gas or nitrogen control  1 set
Water box          1 set
Cool water machine    1 set


China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330
China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330China Cheap Vacuum Oven for Reflow Soldering of Flip Chip with Tin Ball RS330

 

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