Die Bonding, Process for Placing a Chip on a Package Substrate
DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement system, which can meet the needs of deep cavity substrate patch and eutectic welding. Optional module: nozzle heating module, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protective gas module, substrate preheating module, process monitoring module, chip flip placing module.
The placement accuracy of the system can reach 1um according to different configurations, and the nozzles can be manually replaced according to different sizes of chips. It is a necessary equipment for high-precision adhesive bonding of high-end medical equipment (core imaging module assembly), optical devices (laser LDpalladium bar assembly, VCSEL, PD, LENS, etc.), semiconductor chips (MEMS devices, radio frequency devices, microwave devices, and hybrid circuits). It is pretty suitable for the R&D and the needs of small batch and multi-variety production of research institutes, universities and other research institutions, enterprise laboratories. The machine has high precision, stable performance and high cost performance. The operation is very convenient, especially suitable for high-precision chip assembly.
Standard configuration:
1. Placement system
2. Visual calibration system (systematic inspection and calibration of the precision of the mounted
chip)
3. Laser ranging system
4. Dipping glue system
5. High-precision visual alignment system
6. Servo motion control system
Optional accessories:
1. Top nozzle heating module
2. Nozzle pressure feedback system
3. Dispensing and UV curing module
4. Nitrogen protection gas module
5. Substrate preheating module
6. Eutectic platform
7. Chip flip placing module
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