High precision counter soldering system BGA3200
BGA3200 integrates: high precision BGA mounting system, PCB driving system, high precision welding system.
SMD pin and PCB pad images on industrial CCD optical system at the some time,
Industrial LCD observes and monitors the position process.
High-precision linear guiderail and turntable adjusts X, Y, Z axis direction and θ angle of PCB.
Double color splitting light brights each area freely for BGA position accurately ,
it mainly target BGA, CSP chip repair and weld, as well as QFP, PLCC and other SMT components.
Feature of mounting and driving system see Pictures as follows:
Feature of welding system:
1. Unsoldering and soldering process could be controlled by PC, and BGA soldering and repairing curve will be stored in computer for using on repeat operation or analysis in the future.
2. Intelligent BGA unsolder system cooperating with bottom preheating table improve the welding efficiency and prevent PCB distortion
3. Real-time temperature test can control the welding process accurately
4. All-purpose worktable support for easy to take out and fix different size and thickness of PCB.
Re-balling working station
All purpose re-balling station
Four adjustable modules at the bottom can be adjusted to meet different template size require, the template on the top also can be replaced according to different BGA ball diameter required.
Weight About 150kg
Total Power 2300W
Nozzle Heating 800W
Bottom Warm-up 1200W
Pressure 220V (50Hz)
PCB Size Max250mm*300mm
PCB Thickness 0.5-3mm
Mounter Size Max18mm*18mm; Min7mm*7mm(48mm*48mm optional)
Mounter Precision 10um
Picking-up Power 1.0N
Temperature control system Model K intelligent system, closed loop control
contraposition system Automatic contraposition
contraposition &drive system Step motor laser
PCB transmissiom system Manual
PCB transmissiom &drive system Precisely manual move
Planting ball table configuration