Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Cleaning Process: Vacuum Plasma Cleaning
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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
  • Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
  • Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
  • Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
  • Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
  • Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
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Basic Info.

Model NO.
VPC42
Style
Integrated Style
Clean Type
Automatic in Line
Usage
Auto Industry, Power Industry, Petrochemical Industry, Mechanical Engineering, Metallurgical Industry
Principle
Chemical Cleaning
Certification
CE, ISO
Control
CNC
Automation
Automatic
Condition
New
Remote Control
With Remote Control
Customized
Customized
Transport Package
Plywooden Case
Specification
CE
Trademark
TORCH
Origin
Beijing, China
HS Code
8479899990
Production Capacity
10set/Month

Product Description

Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine used for plasma surface treatment process in IC carrier plate


Chinese Economical Torch Offline Vacuum Plasma Cleaning Machine Used for Plasma Surface Treatment Process in IC Carrier Plate
Equipment name: Offline vacuum plasma cleaning machine
Modle No.: VPC42
Manufacturer : Beijing Torch SMT Incorporated Company


I. Equipment name, type number, origin and delivery date
1.1 Equipment name: Vacuum plasma cleaning machine
1.2 Model No.: VPC42
1.3 Origin (country, manufacturer): Beijing Torch SMT Incorporated Company
1.4 Delivery date: 4-8 weeks after the contract comes into effect
1.5 Mainly used for plasma surface treatment process in semiconductor enclosure fields such as silicon wafer, glass substrate, ceramic substrate, IC carrier plate, copper lead frame, large-size single-sided substrate power board, IGBT module, MEMS sensor with fixture, microwave device, filter, RF device, etc.
II. Main technical performance parameters:
2.1 volume of vacuum chamber: 42L
2.2 vacuum degree:
The maximum vacuum degree of VPC42 vacuum plasma cleaner is less than 2 Pa (mechanical dry pump 40L/Minute)
2.3 Effective cleaning area:
Single cleaning area: 350 *350mm
15 layers: 15mm interval: 40KHZ 2KW intermediate frequency (surface treatment)
5 layers: 50mm interval, 13.56HZ 300W radio frequency (volume processing, with water cooling)
2.4 Height of vacuum chamber:
Chamber height: 350mm (effective size)
2.5 Cleaning temperature:
Low temperature cleaning (below room temperature).
2.6 Cleaning frequency: 30-120s
2.7 Cleaning effect: the dyne value can reach 70. The water drop angle is 15 degrees, and it can be optimally controlled within 10 degrees(Workshop with air cleanliness at Class 100 dust-free can be cleaned within 4 hours)
2.8 Gas can be used:
Argon, nitrogen, oxygen, nitrogen hydrogen mixture, hydrogen and Carbon tetrafluoride, etc.
2.9 VPC42 vacuum plasma cleaning machine is equipped with software control system:
The software control system is easy to operate, it enables control equipment connecting, and various cleaning process curves can be set, and curves can be set, modify, store and select for use according to different processes; The software has its own analysis function, which can analyze the process curve. The software control system will automatically record the cleaning process data, temperature curve, time and alarm related data in real time to ensure the traceability of product cleaning process.
2.10 The equipment does not need to be calibrated thus no more calibration fees will occur.
2.11 Operating power consumption:
2.5KW, excluding the power consumption of chiller(intermediate frequency)
1.5KW, excluding the power consumption of chiller (Radio frequency)
2.12 The function of over temperature alarm and recording. (standard configuration)
VPC42 vacuum plasma cleaning machine is functioned with workpiece surface over temperature protection,alarming, temperature safety protection and recording of the whole machine during cleaning process.
2.13 Nitrogen, argon and other flow management and analysis systems (Software + hardware). (Optional)
VPC42 vacuum plasma cleaning machine is functioned by real-time management and analysis of process gases such as nitrogen and argon consumed by the whole machine, and can record and analyze the gas consumption, daily consumption, weekly consumption and different time period consumption in real time.
2.14 Process gas pressure alarm function and analysis system (Software + hardware). (Optional)
VPC42 vacuum plasma cleaning machine is functioned by undervoltage alarm, recording and analysis of process gas source in the production process of the whole machine, which is very useful for product quality traceability.
2.15 Energy management and analysis system (Software + hardware). (Optional)
VPC42 vacuum plasma cleaning machine is functioned by real-time management and analysis of energy consumption, and can analyze the recording of real-time power consumption, daily power consumption, weekly power consumption, time period power consumption, etc.
2.16 With output statistical management and analysis system (software + hardware). (Optional)
The VPC42 vacuum plasma cleaning machine has the function of real-time management and analysis of the output of the vacuum processing products of the whole machine. It can log and record and analyze the real-time shift output, daily output, weekly output, and monthly output for product quality traceability and analysis.
2.17 MES data interface subsystem (Software + hardware). (optional)
VPC42 vacuum plasma cleaning machine is also functioned by MES data interface of the whole machine, and MES system can be selected and configured to complete various data acquisition and analysis of intelligent equipment.
2.18 Overall dimensions:
850*960*1680mm (excluding alarm light)
2.19 Internal structure: see the right figure




III. Basic composition and configuration:
No Description  configuration qty
1 vacuum plasma cleaning machine Main machine 1set
2 Plasma power system Standard configuration 1set
3 Temperature measurement system Standard configuration(2 groups of temperature measuring thermocouple, 1 for use, 1 for backup) 1set
4 Vacuum system Standard configuration 1set
5 Mechanical pump Standard configuration 1set
6 Water cooling system Standard configuration(Industrial cooling machine is excluded) 1set
7 Industrial cooling machine Optional 1set
8 Process gas system Standard configuration(Process gas pipeline and interface) 1set
9 Nitrogen atmosphere protection system Standard configuration(exclude nitrogen souce supplying) 1set
10 vacuum plasma cleaning machine software system Standard configuration(control software) 1set
11 Industrial computer Standard configuration 1set
12 Plasma Standard configuration 1piece
13 Temperature measurement sensor (spare parts) Standard configuration 2
14 Cooling pipeline (spare parts) Standard configuration 2
15 Process gas volume management and analysis system Optional 1set
16 Process gas pressure alarm and analysis system Optional 1set
17 Power management and analysis system Optional 1set
18 Oxygen content management and analysis system Optional 1set
19 MES data interface system Optional  

IV. VPC42 Technical parameter
Brand Manufacturer Beijing Torch SMT Incorporated Company Remarks
Brief introduction Origin Beijing  
Key components  Temperature sensor US OMEGA  
Vacuum pump KYKY/BSC  
Globe valve Japan brand  
Corossion resistence valve Japan brand  
Low voltage electric system SCHNEIDER  
Botton switch Taiwan JICTEN/SCHNEIDER  
Magnetic proximity sensor Omron  
Heater TORCH  
Key technical index Temperature Low temperature cleaning, temperature is maintained under room temperature  
Min. Vacuum degree 5Pa  
Oxygen content <1ppm  
Production efficiency 20-120S  
Key process index Quality traceability 1. Process gas pressure alarm record. 2. Oxygen content alarm record. 3. Temperature over temperature alarm record. 4. Alarm record of non-compliance of vacuum value  
Intelligence and informatization 1.Intelligent function. If one of the above 4 indicators fails to meet the standard or gives an alarm, an overall alarm and prompt to stop production will be displayed to ensure the production quality. 2. Energy management system, power consumption and nitrogen consumption are counted and displayed in real time in the energy management system. 3. All above information can be seamlessly connected to MES system through data interface to facilitate the decision-making and management of management team.  
Facilities Power 380VAC,20A  
Gas Compressed air(CDA)0.5Mpa  
Nitrogen 0.5Mpa  
Vacuum Equipped with vacuum dry pump   

Note:
The control software for the vacuum plasma cleaning machine of Beijing Torch SMT Incorporated Company is independently developed by Beijing Torch SMT Incorporated Company and Beijing Torch SMT Incorporated Company pocesses the right of software registration without third-party certification.

The vacuum plasma cleaning machine from Beijing Torch SMT Incorporated Company has already obtained a number of national patents. Please do not risk copying!!

 

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