RS Series Small vacuum furnace RS110 with Nitrogen hydrogen hybrid
1.Function Introduction:
TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven. It especially designed for the fields in small batch production, R&D and functional materails test, etc.
RS series Vacuum Reflow Oven is heated in Vacuum environment to realize holesless soldering, can fulfill the test requirement from R&D department and production requirement of small batch.
In general, when soldering, there're some hollow areas in soldering parts, RS series Vacuum Reflow Oven can minimize the hollows into 2%, the normal oven is nearly 20%.
RS series Vacuum Reflow Oven applicable to fluxless soldering without hollows at solder pot, available in various of gases, such as N2, N2/H2 95%/5%.
RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder slice.
RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.
2. RS series vacuum oven is mainly for high-demanding in welding, for example the military products, industrial high reliability product, even the nitrogen protective or the vapor phase soldering can not reach the demand. Like the material testing,chip package,power equipment, automobile product, train control, space and airborne systems etc soldering which need high reliability circuit. It need elimination and reduce the empty and oxidation welding material. How to reduce the voidage effectively, decrease the oxidation of the pad and the component pins? The vacuum oven is the only choice. If you want to achieve the high welding quality, we must need the vacuum oven machine. This is the latest process innovation of military field Germany Japanese and the United Stated etc.
3. Industry application: RS series vacuum oven is the best choice for R&D, process research and development, material test, device packaging, and it is the best option for high-end development and production in military industrial enterprises, research institute, colleges, universities aerospace.
4. Application areas:Mainly applied in no defect welding and welding without flux of chips and board, Shell and cover, such as IGBT package, paste crafts, Laser diode packaging technology, Hybrid integrated circuit packages, shell cover Board packaging, MEMS and vacuum packaging;
Features:
1. Soldering under full vacuum. The vacuum value can be up 10-3mba. (10-6-mba optional).
2.Welding environment is with low activity flux.
3. Professional software control can achieve the perfect operating experience.
4.40 industry segments programmable temperature control system can help to set the perfect technology curve.
5. Temperature settings can be adjusted, which can set the welding materials technology curve that is much closer to perfect the process.
6. Water-cooling technology achieves the industry's fastest cooling effect (standard)
7. Online temperature measurement function. Accurate measurement of the weld zone temperature uniformity. Provide professional support for the process of adjustment.
8. Nitrogen or other inert gas can meet the special requirements of the welding process.
9. Highest temperature is 400 ºC (higher optional), which can meet all the requirements of the soldering process.
10. Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (weldments over temperature protection, machine temperature safety protection, safe operation protection, welding cooling water protection power protection)
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