China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d

Product Details
After-sales Service: Engineer Go Oversea for Training
Condition: New
Certification: ISO, CE
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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
  • China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
  • China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
  • China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
  • China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
  • China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
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Basic Info.

Model NO.
V3D
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Soldering Area
300*300mm
Furnace Height
100mm
Max Temperature
450c
Vacuum
10PA
Max. Heating Rate
120c/Min
Max Cooling Rate
180c/Min
Cooling Way
Air-Cooled / Water-Cooled (Shell, Heating Plate)
Gas
Nitrogen. Formic Acid
Voltage
380V 25-50A
Transport Package
Polywood Case
Specification
90*11*130cm
Trademark
TORCH
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Set/Year

Product Description

China Microelectronics Pressure Vacuum Reflow Soldering Machine V3D
Model: V3D
China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d

vacuum reflow oven Product introduction:

1. Soldering temperature: The maximum soldering temperature ≤450 ºC.
2. Vacuum rate: Oil vacuum pump, the ultimate vacuum ≤10 Pa and the working vacuum is 50Pa - 200 Pa. 
3. Effective soldering area: ≤300mm * 300mm
4. Furnace height: ≤100mm.
5. Heating method: Infrared radiant heating at the bottom + infrared radiant heating at the top. The hot plate uses a semiconductor-grade graphite platform. The graphite platform is not easy to deform for a long time, and has high thermal conductivity, making the surface temperature of the hot plate more uniform.
6. Temperature uniformity: within the effective soldering area ≤ ± 2%.
7. Heating rate:  120ºC/min.
8. 
Cooling rate: 180 ºC/ min (during the highest temperature of no-load - 200ºC).
9. Meet the soldering requirements of various solders (≤450ºC).
For example: In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2 and other pre-formed soldering pads (flux-free eutectic welding) and solder pastes of various compositions
10. Soldering void ratio:
V3D vacuum reflow furnace has been tested by a large number of customers when soldering, and the void ratio can be controlled below 3%.
China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d

Feature of the vacuum reflow oven:

  1. Vacuum soldering vacuum degree , can be up to 10-3mba (Molecular pump 10-6mba is optional)
  2. Low active flux welding environment
  3. Touch screen control and professional software, get perfect operation .
  4. 40 sections programmed temperature control system , can set perfect welding profile carve .
  5. Temperature setting used touch control model , and can be pulled the carve by hand.
  6. Unique water cool system , realize the fastest cooling.
  7. 4 temperature testing. Realize the measurement of temperature uniform in welding zone. Supply professional reference in process testing .
  8. Formic acid, nitrogen or other Inert gas suit for special welding process.
  9. Patent design in online real video system , can take video of every process and provide good reference for quality tracking , perfect data support in researching of welding and test in materials .
  10. Highest temperature :450 degree Celsius (higher temperature is optional) ,meet all soft welding needs.
  11. View window on the cover.
  12. 8 safety system monitor and protect system (Overtemperature protection , The temperature security protection , air pressure protection ,water pressure protection, safety operation protection ,water cool protection, liquid volume protection , power off protection )
China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d

Vacuum furnace Technical parameter:

Model No

V3

V3D

V4D

process chamber size

280mm*260mm

300mm*300mm

380mm*310mm

Power

30KW

40KW

50KW

Height of oven

100mm (other height is optional)

Max Temperature 

450°C

Interface

serial port /USB

Control way

40 sections temperature control + vacuum pressure control

Temperature curve

Can save 40 sections temperature curve

Power supply

380V 25-50A

China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d

Vacuum reflow soldering oven V3/V3D/V4DStandard spare part :

Main body  1 set
Touch screen control computer 1 set
Temperature control  1 set
Pressure control      1 set
Closed cycle water cool system 1 set
4 real temperature test mode  1 set
Vacuum pressure transfer  1 set
Inert gas or nitrogen control  1 set
Water box          1 set
Cool water machine    1 set

Vacuum reflow soldering oven V3/V3D/V4D Optional spare part:

Corrosion resistant diaphragm pump (10mba)    

Rotary vane pump (10-3mba)      

Whirling molecular pump (10-6mba)      

Formic acid(for V serial oven)      

Component fixer

110V power supply
China Microelectronics Pressure Vacuum Reflow Soldering Machine V3d
China Microelectronics Pressure Vacuum Reflow Soldering Machine V3dChina Microelectronics Pressure Vacuum Reflow Soldering Machine V3d

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