Pick and Place Machine for BGA Chips

• Function: Abrasion Resistance, Lubrication, High Temperature Resistance
• Demoulding: Slide
• Condition: New
• Model NO.: BGA3000
• Certification: CCC, PSE, RoHS
• Warranty: 24 Months
• Automatic Grade: Semiautomatic
• Installation: Vertical
• Driven Type: Pneumatic
• Mould Life: <300,000 Shots
• Max Mounting BGA Siz: ≤ 20mm X20mm
• Min Mounting BGA Size: 3.5× 3.5mm
• Mounting Accuracy: +/- 10um
• PCB Size Can Be Suitable: 400× 350mm
• Machine Size: 400 * 550 * 430mm
• Power Supply: 220V, 50Hz
• Video Link 1: Https://Yadi.Sk/I/T39sdy9tcuyg9
• Transport Package: Wooden Case
• Specification: 400 * 550 * 430mm
• Trademark: Torch
• Origin: Beijing, China
• Production Capacity: 300 Sets/Year

Product Description

Pick and Place Machine for BGA Chips



Technical Parameter:
*Max mounting BGA size: ≤ 20mm x20mm
*Min mounting BGA size: 3.5× 3.5mm
* PCB size can be suitable: 400× 350mm
Max Picking strength: 2.0N
Picture output sign type: PAL
Machine size: 400 * 550 * 430mm
Net weight: 15Kg
Power supply: 220v, 50Hz
Power: 200w

Light supply: Use stable LED light, which can help definite picture position accurately.
Light color: Soft LED light, PCB pad in red LED light (optional)
Air supply: Industrial Diaphragm pump, large air capacity to improve Max BGA mount.

Features:
----High precision linear guiderail and turn table can achieve 2μ M high resolution deformation adjustment in the range of 13mm and 2'' high resolution regulate exactly in the range of 360 º C to ensure high accuracy in the whole repair process.

----Double color light splitting technology has stable light, which is suitable for accurate position, it takes red LED soft light illuminate on chips while green light on PCB pad. The intensity of the ray could be controlled to strengthen the image contrast.

----Advanced optical system ensures BGA component PIN foot and PCB pad image on CCD at the same time. Single wavelength prism group controls the polarization ray on PCB board effectively and improve the definition of image.

----Professional nozzle has a reliable and stable suction to pick up the chips
Cooperating with industrial Diaphragm Pumps.

----High-defi CCD outputs PAL and VGA signals to achieve the contact to industrial LCD and PC monitor.

Main parts:
1, suction cup, 2, X-direction micro-adjust Handle 3. Y-direction micro-adjust Handle, 4. Angle micro-adjust Handle, 5. Air pipe, 6. Diaphragm Pump, 7. Light supply, 8, Fasten Handle, 9, PCB working table, 10, Drawer-type Handle, 11, Control Case, 12 Monitor.

Model	BGA3000
Max mounting BGA size	≤ 20mm x20mm
Min mounting BGA size:	3.5× 3.5mm
PCB size can be suitable	400× 350mm
Max Picking strength	2.0N
Power supply	220v, 50Hz