Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers

Product Details
After-sales Service: Engineer Online or at Site
Condition: New
Certification: ISO, CE
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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
  • Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
  • Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
  • Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
  • Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
  • Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
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Basic Info.

Model NO.
H5
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Soldering Area
500*300*70mm*5layers
Furnace Height
100mm(Other Hights Is Optional)
Temperature Range
350-450 Degree
Max. Heating Rate
120c/Min
Max. Cooling Rate
5c/Min
Cooling Way
Air-Cooled / Water-Cooled (Shell, Heating Plate)
Reductive Atmosphere
N2 and H2 Mixture, Pure H2, N2
Voltage
380V 50-60A
Transport Package
Wooden Case
Specification
129*140*185cm
Trademark
TORCH
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Set/Year

Product Description

MEMS IGBT Vacuum Reflow Soldering System Single Chamber 5 layers H5/H6


Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers

Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers


Technical Data:

Application Fields: IGBT module, MEMS packaging, high power electronics packaging, photoelectric device packaging, hermetic packaging etc.

Equipment Introduction:
1. viewing system: cavity has the visible window, can observe welding process at any time.
2. heating system: the equipment configure 5/6 set heating system, at the same time it is working in a vacuum.
3. vacuum system: The equipment configurates the large vacuum pump,can quick achieve the vacuum environment of high temperature 0.1mbar, mbar 0.01mbar.
4. cooling system: The equipment adopts water cooling system,to make sure can fast cooling at the high temperature and vacuum environment
5. the software system: heating and cooling programmable control, heating and cooling curve can be set according to craft, each curve can be automatically generated,can be editted, modified, and storaged.
6. the control system: a modular software design can set process curve, vacuum extraction, the atmosphere, cooling, etc independently, and the combined production process achieve the one key operation.
7. the atmosphere system: Free soldering flux can be achieved.And the machine can be filled with H2, N2 / H2 gas mixture, HCOOH, N2 or protective gas reduction, etc., ensure there is no empty spot.
8. the data recording system: real-time monitoring and data recording system, software curve recording function,temperature curve saving function, process parameters saving function, device parameters recording and calling function.
9. the protection system: eight system security status monitoring and security designing (weldments overtemperature protection, machine temperature safety protection, air pressure alarm protection, pressure protection, safe operation protection, welding cooling water protection, level of protection, power protection).
   
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers   Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers

Features:

1. high vacuum degree: 0.01 mbar high vacuum, vacuum degree of cavity numerical real-time display, and can control and adjust
2. vacuum pumping speed: 50 m³/h
3. process cavity pressure: 0.1 mbar
4. bearing of the heating plate layer insulation, single bearing ≥20 kilograms
5. fast cooling speed: set up independent water and gas cooling equipment in the cavity, cause the welding device for rapid cooling.
6. welding quality of low void rate ensure that after welding, large welding plate implementation avhive hole rate under 3% .
7. meet the jinxi welding, high lead solder, lead-free materials such as high temperature welding requirements and technical requirements of high quality welding solder paste in the vacuum environment.

8. high capacity, each layer of the actual welding area is 500 * 300 mm, multilayer work at the same time, achieving the mass production of device .

Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
 
Application Fields: IGBT module, MEMS packaging, high power electronics packaging, photoelectric device packaging, hermetic packaging etc.

Specifications:

Model

H5

H6

Welding size

500*300*100mm*5 layers

500*300*100mm*6 layers

Single layer weight bearing

20KG

Highest temperature

350ºC - 450ºC

Control system

Temperature control system+ Vacuum system + Cooling system+ Atmosphere system +Software control system

Temperature curve

Can store several 40 segment temperature curve

Rated power

9KW*5 layers

9KW*6 layers

Vacuum degree

Highest 0.01mbar

Max heating temperature

120ºC/minute

Max cooling temperature

50ºC/minute

Atmosphere reduction

N2, HCooH, H2 and N2H2 mixture

Power source

380V 20-50A

Temperature uniformity

±1%

Dimension

780*1000*1500mm


Related Products:
 
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
Company:
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers

TORCH CO,. Ltd was found in 2001, focus on R&D and production of SMT equipment. It has been the leader on SMT industry in domestic. TORCH Co,. Ltd keeps the faith "Intelligent production, Intelligently create future" and developed many SMT equipment by itself. At present, TORCH C., Ltd owns more than 100 patents, brands and software rights. Moreover, it also passed ISO9001, CE and other certifications. Strategic objectives: to optimize the technology based on keeping the existing mature development, production, sales and service mode and continue to consolidate and strengthen its advantage position in the SMT electronic equipment field, with existing key products as the center, to expand the supply chain has become the Internet + intelligent manufacturing electronic factory of 2025 and the overall solution project of industrial upgrading optimized brand.
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers


Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
Mems IGBT Vacuum Reflow Soldering System Single Chamber 5 Layers
 

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