RS330 Vacuum Reflow Soldering Oven for Laser, Micro LED, Endoscope

• Condition: New
• Certification: CCC, PSE, FDA, RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Soldering Size: 110mm*110mm
• Model NO.: RS330
• Furnace Height: 40mm(Other Heights Are Optional)
• Temperature Range: Temperature Range
• Connector: Serial 485 Network / USB
• Model: RS110
• Transport Package: Wooden Case
• Specification: 450*450*1300mm
• Trademark: Torch
• Origin: Beijing
• HS Code: 8501109101
• Production Capacity: 20 Sets/Month

Product Description

RS330 Vacuum Reflow Soldering Oven for Laser, Micro LED, Endoscope


1.Introduction:
RS series Vacuum Reflow Oven are especially designed for the fields in small batch production, R&D and functional materails test, etc.

In general, when soldering, there're some hollow areas in soldering parts, RS series Vacuum Reflow Oven can minimize the hollows into 2%.

RS series Vacuum Reflow Oven applicable to fluxless soldering, available in various of gases, such as N2, N2/H2 95%/5%.

RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder foil.

RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.

Specification:
 

Model	RS220	RS330
Soldering Size	220mm*220mm	330*330mm
Chamber height	100mm(other heights are optional)
Temperature	Up to 450ºC
Heater	Infrared + Hard graphite (SiC coating)
Inert gas	Nitrogen + formic acid
Connector	Serial 485 network / USB
Control Way	40 segments Temperature control + PID control
Temperature curve	can store several curves Temperature of 40 segments
Voltage	220V 25A	220V 28A
Rated Power	9KW	11KW
Actual Power	6KW(Don't choose a vacuum pump)	8KW(configurate  molecular pump)
	8KW(configurate  molecular pump)	10KW(configurate  molecular pump
The maximum heating rate	120C/min.	120C/min.
The maximum cooling rate	120k/min(water+nitrogen)	120/min(water+nitrogen)
Cooling Way	Air-Cooled/ Water-Cooled	Air-cooled /water-cooled

Detail

Products

Application:
Mainly applied in fluxless soldering between chips and board, Shell and cover, such as IGBT package, paste crafts, Laser diode packaging, Hybrid integrated circuit packages, shell cover Board packaging, MEMS and vacuum packaging;


Features:
1. Soldering under full vacuum. The vacuum value can be up 10-3mba. 
2. Professional software control can achieve the perfect operating experience.
3. 40 industry segments programmable temperature control system can help to set the perfect technology curve.
4. Water-cooling technology achieves the industry's fastest cooling effect (standard)
5. Online temperature measurement function. Accurate measurement of the heat zone temperature uniformity. Provide professional support for the process of adjustment.
6. Nitrogen or other inert gas can meet the special requirements of the soldering process.
7. Highest temperature is 450 ºC (higher optional), which can  meet all the requirements of the soldering process.
8. Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (over heating protection, temperature safety protection, safe operation protection, cooling water protection, power protection)

Standard:

1. one set computer
2. one set industry control computer
3. one set temperature control software
4. one set temperature controllor
5. one set pressure controllor
6. one set Inert gas( nitrogen)control;

Optional:
1.Chiller
2.Vacuum Pump (mechanical oil or oil-free pump)
3. Hydrogen and Nitrogen mixer (95%N₂ 5%H₂)