Single Chamber Vacuum reflow oven for lab R&D using with 2% void rate
Applications:
Solder reflow with and without flux
Wafer bump and solder ball reflow
Flip chip
Encapsulation and sealing of housings
High Power LED module
Resistor paste firing
IGBT/DBC
Die attachment
RS Series vacuum reflow oven
Function Introduction:
1.TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven.
RS series Vacuum Reflow Oven applicable to fluxless soldering without hollows at solder pot, available in various of gases, such as N2,Argon.
RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder slice.
RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.
2.Industry application:RS series vacuum oven is the best choice for R&D, process research and development, material test, device packaging, and it is the best option for high-end development and production in industrial enterprises, research institute, colleges, universities aerospace.
Features:
1.Soldering under full vacuum.The vacuum value can be up 10-3mba.(10-6-mba optional)
2.Solderinging environment is with low activity flux.
3.Professional software control can achieve the perfect operating experience.
4.40 industry segments programmable temperature control system can help to set the perfect technology curve.
5.Temperature settings can be adjusted, which can set the welding materials technology curve that is much closer to perfect the process.
6.Water-cooling technology achieves the industry's fastest cooling effect (standard)
7.Online temperature measurement function.Accurate measurement of the weld zone temperature uniformity.Provide professional support for the process of adjustment.
8.Nitrogen or other inert gas can meet the special requirements of the welding process.
9.Highest temperature is 450 ºC (higher optional), which can meet all the requirements of the soldering process.
10.Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (weldments over temperature protection, machine temperature safety protection, safe operation protection, welding cooling water protection, power protection)
Standard:
Packing List
One set computer
One set industry control computer
One set temperature control software
One set temperature controllor
One set pressure controllor
One set Inert gas or nitrogen gas control valve
Optional:
Corrosion resistant diaphragm pump, vacuum 10mba;
Rotary vane pump, used for vacuum of 10-3mba;
Eddy turn molecular pump system, used for vacuum of 10-6mba;
4.Hydrogen and hydrogen-type safety device
5.High Temperature Module (500 degree high temperature)
Model |
RS110 |
RS160 |
RS220 |
Soldering Size |
110mm*110mm |
160*160mm |
220*220mm |
Furnace height |
40mm(other Hights is optional) |
Temperature Range |
Up to 400 |
Connector |
Serial 485 network / USB |
Control Way |
40 segments Temperature control + Vacuum Pressure Control |
Temperature curve |
can store several curves Temperature of 40 segments |
Voltage |
220V 25A |
220V 28A |
220V 36A |
Rated Power |
9KW |
11KW |
15KW |
Actual Power |
6KW(Don't choose a vacuum pump) |
8KW(configurate molecular pump) |
11KW(Don't choose a vacuum pump) |
8KW(configurate molecular pump) |
10KW(configurate molecular pump |
13KW(configurate molecular pump) |
Dismension |
450*450*1300mm |
450*450*1300mm |
500*450*1300mm |
Wight |
210KG |
240KG |
270KG |
The maximum heating rate |
120/min |
120/min |
120/min |
The maximum cooling rate |
80k/min |
80k/min |
80k/min |
Cooling Way |
Air cooling/water cooling |
Air-cooled / water-cooled |
Air-cooled / water-cooled |
Vacuum soldering result:
Process
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