Vpc3I Vacuum Plasma Cleaning Machine-Inline

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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • Vpc3I Vacuum Plasma Cleaning Machine-Inline
  • Vpc3I Vacuum Plasma Cleaning Machine-Inline
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Basic Info.

Model NO.
VPC3i

Product Description

VPC3i Vacuum plasma cleaning machine(Inline)

Inline vacuum plasma cleaning machine
Modle No.: VPC3i
Manufacturer : Beijing Torch SMT Incorporated Company


I. Equipment name, type number, origin and delivery date
1.1 Equipment name: Inline vacuum plasma cleaning machine
1.2 Model No.: VPC3i
1.3 Origin (country, manufacturer): Beijing Torch SMT Incorporated Company
1.4 Delivery date: 4-8 weeks after the contract comes into effect
1.5 Mainly used for plasma surface treatment process in semiconductor enclosure fields such as silicon wafer, glass substrate, ceramic substrate, IC carrier plate, copper lead frame, large-size single-sided substrate power board, IGBT module, MEMS sensor with fixture, microwave device, filter, RF device, etc.
II Main technical performance parameters:
2.1 volume of vacuum chamber: 3L
2.2 vacuum degree:
The maximum vacuum degree of VPC3i vacuum plasma cleaner is less than 10 Pa (mechanical dry pump 8L)
2.3 Effective cleaning area:
Single cleaning area: 350 * 100 * 85mm
Plasma frequency: 13.56hz 300W  RF (volume treatment, with water cooling)
2.4 Height of vacuum chamber:
Furnace height: 100mm (effective size)
2.5 Cleaning temperature:
Low temperature cleaning (below room temperature).
2.6 Cleaning frequency: 30-120s
2.7 Cleaning effect: the dyne value can reach 70. The water drop angle is 15 degrees, and it can be optimally controlled within 10 degrees(Workshop with air cleanliness at Class 100 dust-free can be cleaned within 4 hours)
2.8 Gas can be used:
Argon, nitrogen, oxygen, nitrogen hydrogen mixture, hydrogen and formic acid, etc.
2.9 VPC3i vacuum plasma cleaning machine is equipped with software control system:
The software control system is easy to operate, it enables control equipment connecting, and various cleaning process curves can be set, and curves can be set, modify, store and select for use according to different processes; The software has its own analysis function, which can analyze the process curve. The software control system will automatically record the cleaning process, temperature curve, time and alarm related data in real time to ensure the traceability of product cleaning process.
2.10 The equipment does not need to be calibrated thus no more calibration fees will occur
2.11 Operating power consumption: 2.2kW, excluding the power consumption of chiller
2.12 The function of over temperature alarm and recording. (standard configuration)
VPC3i vacuum plasma cleaning machine is functioned with workpiece surface over temperature protection,alarming, temperature safety protection and recording of the whole machine during cleaning process.
2.13 Nitrogen, argon and other flow management and analysis systems (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is functioned by real-time management and analysis of process gases such as nitrogen and argon consumed by the whole machine, and can record and analyze the gas consumption, daily consumption, weekly consumption and different time period consumption in real time.
2.14 Process gas pressure alarm function and analysis system (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is functioned by undervoltage alarm, recording and analysis of process gas source in the production process of the whole machine, which is very useful for product quality traceability.
2.15 Energy management and analysis system (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is functioned by real-time management and analysis of energy consumption, and can analyze the recording of real-time power consumption, daily power consumption, weekly power consumption, time period power consumption, etc.
2.16 Oxygen content management and analysis system (Software + hardware) (optional)
VPC3i vacuum plasma cleaning machine is functioned by real-time management and analysis of oxygen content in the vacuum chamber of the whole machine. It can analyze, record and analyze the PPM value of oxygen content in real time for product quality traceability and analysis.
2.17 MES data interface subsystem (Software + hardware). (optional)
VPC3i vacuum plasma cleaning machine is also functioned by MES data interface of the whole machine, and MES system can be selected and configured to complete various data acquisition and analysis of intelligent equipment.
2.18 Overall dimensions:
550 * 1260 * 1480mm (excluding alarm light)
2.19 Internal structure: see the right figure
 

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