• High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
  • High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
  • High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
  • High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
  • High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
  • High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate

High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate

After-sales Service: Engineer Go Oversea for Training
Condition: New
Certification: ISO, CE
Warranty: 12 Months
Automatic Grade: Semiautomatic
Installation: Vertical
Diamond Member Since 2010

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Basic Info.

Model NO.
V4D
Soldering Area
380*310mm
Chamber Height
100mm
Temperature Range
Room--450 C
Voltage
380V 50A
Max. Heating Rate
120c/Min
Max Cooling Rate
180c/Min
Cooling Way
Air-Cooled / Water-Cooled (Shell, Heating Plate)
Transport Package
Polywood Case and Foam
Specification
1200*1100*1400mm
Trademark
TORCH
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Set/Year

Product Description


High intensity LED attach Vacuum / Pressure Reflow Oven with low void rate

Model: V4D

High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate

V4D Vacuum reflow oven Product introduction:

  1. The name V3/V4/V5 is called according Vacuum, means professional industrial vacuum reflow oven.
  2. Why chose Vacuum reflow oven? Recently, the main soldering tool is soldering iron ,reflow oven, wave solder machine or other welding machine, and later update to Nitrogen reflow oven .But some welding, need high requirement of welding, like material testing , Chip packing, Power equipment, Automotive products, Train control , Plane system, aerospace system, which need avoid the Void and oxidation of welding. Vacuum reflow oven is the unique choice to reduce empty and oxidation. Vacuum reflow oven can make sure high quality of welding. Vacuum welding is the new technology in Germany , Japan, USA.
  3. Application of industry: Research institutes ,University, Aerospace , and it's the best choice for R&D , Process research .
  4. Application of field : suit for no defect welding and perfect no flux welding in Chip and PCB Board ,cover and board ,like IGBT package ,solder paste process ,laser diode package , IC package,MEMS and vacuum package .
  5. Vacuum reflow oven is the necessary equipment, Aerospace in USA , European, also get university application in Chip package, electronic welding.

High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate

Application:

IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing

Feature of the vacuum reflow oven:

  1. Vacuum welding environment , can be up to 10-3mba (Molecular pump 10-6mba is optional)
  2. Low active flux welding environment
  3. Touch screen control and professional software, get perfect operation .
  4. 40 sections programmed temperature control system , can set perfect welding profile carve .
  5. Temperature setting used touch control model , and can be pulled the carve by hand.
  6. Unique water cool system , realize the fastest cooling.
  7. 4 temperature testing. Realize the measurement of temperature uniform in welding zone. Supply professional reference in process testing .
  8. Formic acid, nitrogen or other Inert gas suit for special welding process.
  9. Patent design in online real video system , can take video of every process and provide good reference for quality tracking , perfect data support in researching of welding and test in materials .
  10. Highest temperature :450 degree Celsius (higher temperature is optional) ,meet all soft welding needs.
  11. View window on the cover.
  12. 8 safety system monitor and protect system (Overtemperature protection , The temperature security protection , air pressure protection ,water pressure protection, safety operation protection ,water cool protection, liquid volume protection , power off protection )High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate

Vacuum furnace Technical parameter:

Model No

V3

V4

V5

process chamber size

280mm*260mm

380mm*310mm

500mm*380mm

Power

4KW

5KW

10KW

Height of oven

80mm (other height is optional)

Temperature range

up to 350-450°C

Interface

serial port /USB

Control way

40 sections temperature control + vacuum pressure control

Temperature curve

Can save 40 sections temperature curve

Power supply

AC220V, 25-5A

High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
 

Vacuum furnaceStandard configuration :

Main body

V3/V4/V5

V-TSC

Torch screen computer

V-TC

4 thermocouple to measure on device , for external measurement tool

V-PC

Pressure control

V-WC 

Closed loop water cooling system   

V-TTM

4 real temperature test mode

V-VPT

Vacuum pressure transfer

V-IG

Inert gas or nitrogen control

V-WB

Water box

V-Cool water machine

Cool water machine

Vacuum furnace Options and accessories:

V-MPC

Chemcial resistant diaphragm pump for vacuum up to 10 mbar with manometer

V-RVP

Rotary vane pump for vacuum up to 10-3mbar

V-HVP

Turbomolecular pump system for vacuum up to 10-6mbar

V-FA

Formic acid module (integrated in machine)

V-PS

110V power supply

Vacuum furnace Standard spare part :

Main body  1 set
Touch screen control computer 1 set
Temperature control  1 set
Pressure control      1 set
Closed cycle water cool system 1 set
4 real temperature test mode  1 set
Vacuum pressure transfer  1 set
Inert gas or nitrogen control  1 set
Water box          1 set
Cool water machine    1 set


High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate
High Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void RateHigh Intensity LED Attach Vacuum / Pressure Reflow Oven with Low Void Rate

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