China High Vacuum Chip Soldering Reflow Oven / Furnace for IGBT MOS

• After-sales Service: Engineer Go Oversea for Training
• Condition: New
• Certification: ISO, CE
• Model NO.: HV3
• Warranty: 12 Months
• Automatic Grade: Semiautomatic
• Installation: Vertical
• Process Environment: Nitrogen, Formic Acid
• Soldering Area: 300*300mm
• Chamber Height: >=100mm
• Max Temperature: 500 C
• Maximum Vacuum: 1X10-6bar
• Heating Elements: Infrared Heating Lamps
• Max. Heat up Ramp: 120c/Minute
• Max. Cool Down Ramp: 60-120/Minute
• Cooling Way: Nitrogen/Water-Cooled (Shell, Heating Plate)
• Heating Plate: Sic Coated Graphite
• Control Deviation: +/- 1°c
• Voltage: 220V 25-60A
• Weight: 360kg
• Transport Package: Polywood Case and Foam
• Specification: 950*1200*1100mm
• Trademark: TORCH
• Origin: Beijing, China
• HS Code: 8514101000
• Production Capacity: 100 Set/Year

Product Description

China High Vacuum Chip soldering reflow oven / furnace for IGBT MOS

Model: HV3-3

Application:

IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing

Feature of the vacuum reflow oven:

1. Soldering temperature: the maximum soldering temperature of HV3-3 vacuum eutectic furnace is ≥ 500 ºC.

2. Vacuum degree: limit vacuum degree ≤ 10-6 PA working vacuum: 10-6 PA.

3. Effective welding area: ≥ 300mm * 300mm

4. Furnace height: ≥ 100mm, customized for special height.

5. Heating method: infrared heating at the bottom + infrared heating at the top. The heating plate adopts semiconductor silicon carbide graphite platform. It is not easy to deform after long-time use, and has high thermal conductivity, making the surface temperature of the heating plate more uniform.

6. Temperature uniformity: within the effective soldering area ≤± 2%.

7. Heating ramp:120 ºC / minute.

8.Cooling ramp: 60-120 ºC / minute (the ramp of no-load, temperature cooling from 100 ºC).

9. Meet the soldering requirements of soldering materials temperature≤ 500 ºC.

For example: In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2 and other preforms (can be soldered without flux eutectic), solder paste of various components, and curing of materials below 500 degrees.
10. Soldering void rate: After a large number of customer verification, when HV3-3 vacuum eutectic furnace solder with soft solder,  the void rate can be controlled between 0-3%.

Vacuum reflow furnace Technical parameter:

 

Model	HV3-3
Soldering Size	300*300mm
Furnace height	100mm(other Hights is optional)
Maximum Temperature	500ºC
vacuum	≤3Pa with mechanical pump,≤10-6Pa with molecular pump
Heat up ramp	120 ºC / minute
Cool down ramp	60-120 ºC / minute
Voltage	220V, 25-60A
Rated Power	18KW
Weight	360kg
Dimension	600*600*1300mm
Wight	250KG
The maximum heating rate	120ºC/min
The maximum cooling rate	Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min
Cooling Way	Air-cooled / water-cooled (shell, heating plate)

Soldering result:


Company information: