Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process

Product Details
After-sales Service: Engineer Go Oversea for Training
Condition: New
Certification: ISO, CE
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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
  • Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
  • Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
  • Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
  • Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
  • Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
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Basic Info.

Model NO.
RS330
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Soldering Area
330*330mm
Chamber Height
100mm
Temperature Range
Room--450 C
Voltage
220V 50A
Max. Heating Rate
120c/Min
Max Cooling Rate
180c/Min
Cooling Way
Air-Cooled / Water-Cooled (Shell, Heating Plate)
Transport Package
Polywood Case and Foam
Specification
1200*1100*1400mm
Trademark
TORCH
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Set/Year

Product Description


Flux - free soldering, brazing, annealing vacuum soldering process

Model: RS330

RS330 Vacuum reflow oven Product introduction:

  1. The name V3/V4/V5 is called according Vacuum, means professional industrial vacuum reflow oven.
  2. Why chose Vacuum reflow oven? Recently, the main soldering tool is soldering iron ,reflow oven, wave solder machine or other welding machine, and later update to Nitrogen reflow oven .But some welding, need high requirement of welding, like material testing , Chip packing, Power equipment, Automotive products, Train control , Plane system, aerospace system, which need avoid the Void and oxidation of welding. Vacuum reflow oven is the unique choice to reduce empty and oxidation. Vacuum reflow oven can make sure high quality of welding. Vacuum welding is the new technology in Germany , Japan, USA.
  3. Application of industry: Research institutes ,University, Aerospace , and it's the best choice for R&D , Process research .
  4. Application of field : suit for no defect welding and perfect no flux welding in Chip and PCB Board ,cover and board ,like IGBT package ,solder paste process ,laser diode package , IC package,MEMS and vacuum package .
  5. Vacuum reflow oven is the necessary equipment, Aerospace in USA , European, also get university application in Chip package, electronic welding.

Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process

Application:

IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing

Feature of the vacuum reflow oven:

  1. Vacuum welding environment , can be up to 10-3mba (Molecular pump 10-6mba is optional)
  2. Low active flux welding environment
  3. Touch screen control and professional software, get perfect operation .
  4. 40 sections programmed temperature control system , can set perfect welding profile carve .
  5. Temperature setting used touch control model , and can be pulled the carve by hand.
  6. Unique water cool system , realize the fastest cooling.
  7. 4 temperature testing. Realize the measurement of temperature uniform in welding zone. Supply professional reference in process testing .
  8. Formic acid, nitrogen or other Inert gas suit for special welding process.
  9. Patent design in online real video system , can take video of every process and provide good reference for quality tracking , perfect data support in researching of welding and test in materials .
  10. Highest temperature :450 degree Celsius (higher temperature is optional) ,meet all soft welding needs.
  11. View window on the cover.
  12. 8 safety system monitor and protect system (Overtemperature protection , The temperature security protection , air pressure protection ,water pressure protection, safety operation protection ,water cool protection, liquid volume protection , power off protection )Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process

Vacuum furnace Technical parameter:

Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process

Model

RS330

Soldering Size

330*330mm

Furnace height

100mm(other Hights is optional)

Temperature Range

Up to 450ºC

Connector

Serial 485 network / USB

Control Mode

Software control (temperature, pressure, etc.)

Temperature curve

can store several curves Temperature of 40 segments

Voltage

220V

Rated Power

9KW

Actual Power

6KW(without vacuum pump)

Dimension

600*600*1300mm

Wight

250KG

The maximum heating rate

120ºC/min

The maximum cooling rate

Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min

Cooling Way

Air-cooled / water-cooled (shell, heating plate)

 

Vacuum furnace Standard spare part :

Main body  1 set
Touch screen control computer 1 set
Temperature control  1 set
Pressure control      1 set
Closed cycle water cool system 1 set
4 real temperature test mode  1 set
Vacuum pressure transfer  1 set
Inert gas or nitrogen control  1 set
Water box          1 set
Cool water machine    1 set


Flux - Free Soldering, Brazing, Annealing Vacuum Soldering Process
Flux - Free Soldering, Brazing, Annealing Vacuum Soldering ProcessFlux - Free Soldering, Brazing, Annealing Vacuum Soldering Process

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