After-sales Service: | Engineer Go Oversea for Training |
---|---|
Condition: | New |
Certification: | ISO, CE |
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RS330 Vacuum reflow oven Product introduction:
Application:
IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing
Feature of the vacuum reflow oven:
Vacuum furnace Technical parameter:
Model |
RS330 |
Soldering Size |
330*330mm |
Furnace height |
100mm(other Hights is optional) |
Temperature Range |
Up to 450ºC |
Connector |
Serial 485 network / USB |
Control Mode |
Software control (temperature, pressure, etc.) |
Temperature curve |
can store several curves Temperature of 40 segments |
Voltage |
220V |
Rated Power |
9KW |
Actual Power |
6KW(without vacuum pump) |
Dimension |
600*600*1300mm |
Wight |
250KG |
The maximum heating rate |
120ºC/min |
The maximum cooling rate |
Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min |
Cooling Way |
Air-cooled / water-cooled (shell, heating plate) |
Vacuum furnace Standard spare part :
Main body | 1 set |
Touch screen control computer | 1 set |
Temperature control | 1 set |
Pressure control | 1 set |
Closed cycle water cool system | 1 set |
4 real temperature test mode | 1 set |
Vacuum pressure transfer | 1 set |
Inert gas or nitrogen control | 1 set |
Water box | 1 set |
Cool water machine | 1 set |