Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair

Product Details
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Condition: New
Speed: Super High Speed
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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair
  • Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair
  • Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair
  • Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair
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Basic Info.

Model NO.
DB100
Precision
High Precision
Certification
CCC, ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Type
Ultra High-speed Chip Mounter
Max. Chip Size
50*50mm
Min Chip Size
0.2*0.2mm
Mounting Precision
3um
Feeding Mode
2 Inch Waffle Box*2
Transport Package
Wooden Case
Specification
800*750*630mm
Trademark
TORCH
Origin
Beijing
HS Code
8486402900
Production Capacity
1000/Year

Packaging & Delivery

Package Size
800.00cm * 750.00cm * 630.00cm
Package Gross Weight
150.000kg

Product Description

Precision Automatic Pick and place machine for Lcd Tv Flex Acf Cof Led Panel Repair Die Bonding DB100
DB100 Series High Precision
Die Bonding System
Die Bonding, Process for Placing a Chip on a Package Substrate
Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair
DB100 is a manual-semi-automatic micro assembly placement system. The whole
machine uses a marble motion platform to ensure that the entire motion accuracy reaches
the sub-micron level. It comes with a laser height measurement system, which can meet
the needs of deep cavity substrate patch and eutectic welding. Optional module: nozzle
heating module, nozzle pressure feedback system, UV dispensing and curing module,
nitrogen protective gas module, substrate preheating module, process monitoring module,
chip flip placing module.
The placement accuracy of the system can reach 1um according to different
configurations, and the nozzles can be manually replaced according to different sizes of
chips. It is a necessary equipment for high-precision adhesive bonding of high-end
medical equipment (core imaging module assembly), optical devices (laser LDpalladium
bar assembly, VCSEL, PD, LENS, etc.), semiconductor chips (MEMS devices, radio
frequency devices, microwave devices, and hybrid circuits). It is pretty suitable for the
R&D and the needs of small batch and multi-variety production of research institutes,
universities and other research institutions, enterprise laboratories. The machine has high
precision, stable performance and high cost performance. The operation is very
convenient, especially suitable for high-precision chip assembly.

Standard configuration:
1. Placement system
2. Visual calibration system (systematic inspection and calibration of the precision of the mounted
chip)
3. Laser ranging system
4. Dipping glue system
5. High-precision visual alignment system
6. Servo motion control system
Optional accessories:
1. Top nozzle heating module
2. Nozzle pressure feedback system
3. Dispensing and UV curing module
4. Nitrogen protection gas module
5. Substrate preheating module6. Eutectic platform
7. Chip flip

Precision Automatic Die Bonder Pick and Place Machine LED Panel Repair
Precision Automatic Die Bonder Pick and Place Machine LED Panel RepairPrecision Automatic Die Bonder Pick and Place Machine LED Panel RepairPrecision Automatic Die Bonder Pick and Place Machine LED Panel RepairPrecision Automatic Die Bonder Pick and Place Machine LED Panel Repair

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