3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3

Product Details
After-sales Service: 1 Year
Condition: New
Certification: ISO, CE
Manufacturer/Factory & Trading Company

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Year of Establishment
2012-07-31
Management System Certification
ISO 9001, ISO 14001
  • 3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
  • 3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
  • 3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
  • 3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
  • 3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
  • 3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
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Basic Info.

Model NO.
H3
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Soldering Size
600*300*100mm*3 Layers
Furnace Height
100mm
Temperature Range
up to 450 Degree
Gas
Formic Acid, Nitrogen, Hydrogen or Mixer
Layer Weight Capacity
20kg
Vacuum Degree
0.1mbar/0.0001mbar
Max Temperature Rising Speed
>=70c/Min
Max Cooling Rate
>=120c/Min
Rated Power
70kw
Real Power
55kw
Voltage
380V 50-60A
Transport Package
Plywood with Vacuum Package
Specification
165*120*190cm
Trademark
TORCH
Origin
China
Production Capacity
10 PCS/Month

Product Description

3layers large batch vacuum reflow soldering oven for chip packaging soldering H3
3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3

Application Fields: IGBT module, MEMS packaging, high power
electronics packaging, photoelectric device packaging, hermetic
packaging etc.
3layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H33layers Large Batch Vacuum Reflow Soldering Oven for Chip Packaging Soldering H3
Features:
1,high vacuum degree: 0.01 mbar high vacuum, vacuum degree of cavity
numerical real-time display, and can control and adjust ;
2, vacuum pumping speed: 50 /60/90m³/h
3, process cavity pressure: 0.1 /0.0001mbar
4, bearing of the heating plate layer insulation: single bearing ≥20
kilograms
5, fast cooling speed: set up independent water and gas cooling equipment in
the cavity, cause the welding device for rapid cooling.
6, welding quality of low void rate ensure that after welding, large welding
plate implementation avhive hole rate under 3% .
7, meet the jinxi welding, high lead solder, lead-free materials such as
high temperature welding requirements and technical requirements of
high quality welding solder paste in the vacuum environment.
8, high capacity:each layer of the actual welding area is 500 * 300 mm,
multilayer work at the same time, achieving the mass production of device .Equipment Introduction:

Equipment Introduction::
1.viewing system:
cavity has the visible window, can observe welding
process at any time.
2.heating system: the equipment configure 5/6 set heating system, at the
same time it is working in a vacuum.
3.vacuum system: The equipment configurates the large vacuum pump,
can quick achieve the vacuum environment of high temperature 0.1mbar, mbar
0.01mbar.
4. cooling system: The equipment adopts water cooling system,to make
sure can fast cooling at the high temperature and vacuum environment
5. the software system: heating and cooling programmable control,
heating and cooling curve can be set according to craft, each curve can be
automatically generated,can be editted, modified, and storaged.
6. the control system: a modular software design can set process curve,
vacuum extraction, the atmosphere, cooling, etc independently, and the
combined production process achieve the one key operation.
7. the atmosphere system: Free soldering flux can be achieved.And the
machine can be filled with H2, N2 / H2 gas mixture, HCOOH, N2 or protective
gas reduction, etc., ensure there is no empty spot.
8, the data recording system: real-time monitoring and data recording
system, software curve recording function,temperature curve saving function,
process parameters saving function, device parameters recording and calling
function.
9, the protection system: eight system security status monitoring and
security designing (weldments overtemperature protection, machine
temperature safety protection, air pressure alarm protection, pressure protection,
safe operation protection, welding cooling water protection, level of protection,
power protection).
Technical Parameter :
Model
H5
H3
Soldering size
500*300*70mm*5 layers
600*300*100mm*3 layers
Single layer weight bearing
20KG
MAX temperature
350ºC - 450ºC
Control system
Temperature control system+ Vacuum system + Cooling system + Atmosphere system +Software control system
Temperature curve
Can store several 40 segment temperature curve
Rated power
70KW
80KW
Vacuum degree
0.01mbar/0.0001 mbar
Max heating temperature
80ºC/min
Max cooling temperature
150ºC/min
Atmosphere reduction
Power source
Power source
380V 50-60A
Temperature uniformity
±1%
Dimension
1600*1000*1800mm

 

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