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Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D

Name: Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D
Brand: Termway (Beijing) Precision Technology Co., Ltd.
SKU: jAnpHKRbVQkm
Price: 35700.00 USD
Availability: InStock

Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D pictures & photos

After-sales Service:	Engineer Online or at Site
Condition:	New
Certification:	ISO, CE
Warranty:	12 Months
Automatic Grade:	Semiautomatic
Installation:	Vertical

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