- Model NO.: T200C
- Heating Supply: Infrared Ray + Hot Air Convection
- Weight: 39kg
- Cooling System: Transverse Flow Equal Cooling
- Specification: 700*460*310mm
- HS Code: 8514109000
- Effective Working Table Area: 360mm*230mm
- Dimension: 700*460*310mm
- Welding Time: 3min±1min
- Trademark: Torch
- Origin: Beijing, China
Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200C is a fine temperature profile model capable of lead-free soldering.
PC interface software control and visional operation
Heating mode: Infrared ray + Hot air convection
Effective working table area: 360mm *230mm
Patented heater installation For heating evenly
Patented forced air cycling and ventilating technology® For extremely uniform temperature profiling across the board.
Patented oven door actuating device® For no vibration after PCB welding.
It can be used to solidify SMT -Adhesive.
It satisfies all welding requirements of 0201 resistance and capacitance, fine pitch QFP, SOP, PLCC, BGA, CSP and so on. It meets the requirements of small batch and multimode production. It is also suitable for laboratory and research institute.
|Temperature control segment||20-40 segments. the numbers of temperature control segment and the temperature control accuracy are the highest in Market. User can set the segment according to the requirements in soldering machine.|
|Temperature-zone numbers||Single segment and multi-segment control|
|Temperature control system||PC control system . SSR non-contact output.|
|Heating supply||Infrared ray + Hot air convection|
|Effective working table area||360mm*230mm(less than A4)|
|Temperature curve|| It can be set ,adjusted and tested according to the actual requirement .|
|Cooling system||Transverse flow equal cooling|
|Rated voltage||AC single-phase ,220V;50Hz|